Product published by Zhejiang Dehui Electronic Ceramics Co., Ltd
掺锆氧化铝陶瓷覆铜板 (DBC-ZTA 陶瓷覆铜板)
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Materials and content
Production Process
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Powder Preparation
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Molding
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Sintering Process
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Processing Technology
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Features
• ZTA陶瓷基板通过掺杂锆的 Al2O3 陶瓷提高了可靠性
• 与DBC- Al2O3 相比,具有更高的可靠性,与AMB覆铜衬板比,更具有价格优势
• 应用于中等功率输出范围领域
• 热导率在 25°C 温度条件下达 26 W/m*K
• 在 40°C - 400°C 温度范围下,CTE 为 7.5x10-6/K
• 可以承载大电流,载流容量高
• 可定制化,根据客户要求匹配不同的陶瓷厚度,Cu层厚度以及表面处理方式
Product Details
We offer 掺锆氧化铝陶瓷覆铜板 (DBC-ZTA 陶瓷覆铜板), if you are interested in it, please contact us.