Product published by Zhejiang Dehui Electronic Ceramics Co., Ltd
活性金属钎焊氮化硅陶瓷覆铜板
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Production Process
Raw Materials
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Powder Preparation
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Molding
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Sintering Process
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Processing Technology
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Product Description
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- Origin
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778 Asia-Pacific Road, Nanhu District, Jiaxing City, Zhejiang Province, China
Contacts
Features
● 可定制化，根据客户要求匹配不同的陶瓷厚度，Cu层厚度以及表面处理方式
● 热导率在 25°C 温度条件≥ 80 W/m*K
● 在 40°C - 400°C 温度范围下，CTE 为 2.5~3.1 ppm/K
● 抗弯强度≥700MPa,具有更高的可靠性，适用于严苛的工况
● 可以钎焊0.8mm 以上的铜层，载流大，降低热阻
● 通过选择性镀Ag表面处理，配套烧结Ag 工艺，完美适配SiC芯片
Product Details
We offer 活性金属钎焊氮化硅陶瓷覆铜板, if you are interested in it, please contact us.
