Product published by Zhejiang Dehui Electronic Ceramics Co., Ltd
厚膜印刷陶瓷电路板（Thick Film AlNPCB）
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Production Process
Raw Materials
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Powder Preparation
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Molding
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Sintering Process
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Processing Technology
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Product Description
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Contacts
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Features
● 多种陶瓷厚度供选择。
● 优越的电气特性和物理性能
● 导热率≥170W/m*K（是铝基铜基板的约200倍）
● 抗弯强度≥450MPa，在各种环境中拥有良好的电气性能
● 先进的加工工艺，一次成型，通孔密实
● 可制作带有金属围坝的立体陶瓷支架
● 高可靠性，结合力高
● 多种表面处理方式
Product Details
We offer 厚膜印刷陶瓷电路板（Thick Film AlNPCB）, if you are interested in it, please contact us.
