倒装COB陶瓷基板

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Production Process

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Product Description

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No. 558, Fenhu Science and Technology Park, Fenhu Avenue, Wujiang District, Suzhou City, Jiangsu Province, China
Business mode production
Production Process
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Features

技术特点

1)金属线路可定制,最小线宽设计150μm,最小间隙设计100μm,满足倒装芯片应用要求;

2)金属线路印刷偏移量设计±50μm;

3)金属线路材质为银,线路方阻≤3mΩ/□;

4)阻焊采用油墨曝光工艺,图案解析度高;

5)产品符合欧盟ROHS环境要求,可以满足国内外市场需要

Product Details

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