XMCERA Aluminum nitride components for electronic

Aluminium Nitride Ceramic is a ceramic in which aluminum nitride (AIN) is the main phase. Chemical composition AI 65.81%, N 34.19%, specific gravity 3.261g/cm3, white or off-white, single crystal colorless and transparent, sublimation decomposition temperature under normal pressure is 2450 °C. It is a high temperature heat resistant material. Thermal expansion coefficient (4.0-6.0) X10-6/°C. Polycrystalline AIN has a thermal conductivity of 260 W/(m.k), which is 5-8 times higher than alumina, so it has good thermal shock resistance and can withstand extreme heat of 2200 °C. In addition, aluminum nitride is not attacked by aluminum liquid and other molten metals and gallium arsenide, and particularly has excellent corrosion resistance to molten aluminum liquid.

(1) high thermal conductivity (about 320W / m · K), close to BeO and SiC, more than 5 times that of Al2O3;
(2) The thermal expansion coefficient (4.5×10-6°C) is matched with Si (3.5-4×10-6°C) and GaAs (6×10-6°C);
(3) excellent electrical properties (dielectric constant, dielectric loss, volume resistivity, dielectric strength);
(4) good mechanical properties, higher flexural strength than Al2O3 and BeO ceramics, can be sintered at normal pressure;
(5) good optical transmission characteristics;
(6) non-toxic.