河北鼎瓷电子科技有限公司成立于2015年2月，公司注册资金3040万元，在半导体集成电路行业举足轻重，是国家急需的“国产化代替进口”范畴。公司目前主导产品为多层陶瓷基板(外壳)，产品以体积小、重量轻、可靠性高、稳定性好等特点，是国家十四五规划中的强调实施工业强基工程，重点突破关键基础材料、核心基础零部件（元器件）、先进基础工艺、产业技术基础等“五基”瓶颈之一。也是工信部《基础电子元器件产业发展行动计划(2021—2023 年)》特别提出，突破关键材料技术重点支持电子元器件上游电子陶瓷材料。产品广泛应用于产品广泛应用于航空、航天、通讯产业、汽车电子、人工智能、高端仿生医疗等领域。

公司在在石家庄鹿泉区、宁晋设有研发和生产基地，建有国内领先地位的多层HTCC/LTCC陶瓷基板生产线，年产高端半导体传感器、光通信器件用HTCC多层陶瓷封装基座（外壳）100万套+LTCC多层陶瓷基板4万套。

公司自成立以来获批国家高新技术企业、国家科技型中小企业、邢台市科学技术合作奖、邢台市科技企业研发中心、工业企业研发机构B类认定、宁晋县二级绿色工厂认定。通过ISO9001质量管理体系认证、JB9001C武器装备质量管理体系认证；公司一、二期项目分别列入2018、2020年度河北省战略新兴产业化发展项目。

Hebei Dingci Electronic Technology Co., Ltd. was established in February 2015 with a registered capital of 30.4 million yuan. It plays an important role in the semiconductor integrated circuit industry and is in the category of "domestication replacing imports" that the country urgently needs. The company's current leading products are multilayer ceramic substrates (housings). The products are characterized by small size, light weight, high reliability and good stability. They are one of the "five basic" bottlenecks emphasized in the country's 14th Five-Year Plan, including the implementation of industrial base strengthening projects, focusing on breaking through key basic materials, core basic parts (components), advanced basic processes, and industrial technology foundations. It is also specifically proposed in the "Basic Electronic Components Industry Development Action Plan (2021-2023)" of the Ministry of Industry and Information Technology to break through key material technologies and focus on supporting upstream electronic ceramic materials for electronic components. The products are widely used in aviation, aerospace, communications industry, automotive electronics, artificial intelligence, high-end bionic medical and other fields. The company has established R&D and production bases in Luquan District, Shijiazhuang and Ningjin, and has built a domestically leading multi-layer HTCC/LTCC ceramic substrate production line, with an annual output of 1 million sets of HTCC multi-layer ceramic package bases (shells) for high-end semiconductor sensors and optical communication devices + 40,000 sets of LTCC multi-layer ceramic substrates. Since its establishment, the company has been approved as a national high-tech enterprise, a national science and technology-based small and medium-sized enterprise, the Xingtai Science and Technology Cooperation Award, the Xingtai Science and Technology Enterprise R&D Center, the Industrial Enterprise R&D Institution Class B certification, and the Ningjin County Secondary Green Factory certification. Passed ISO9001 quality management system certification and JB9001C weapons and equipment quality management system certification; the company's first and second phase projects were included in the 2018 and 2020 Hebei Province Strategic Emerging Industrialization Development Projects.