Silicon nitride ceramic structural components

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产品类别

材料及含量

生产工艺

原料材料 氮化硅(Si3N4)
粉体制备 -
成型工艺 -
烧结工艺 -
加工工艺 -

产品描述

型号
品牌
Huaci Juli
原产地
Fujian Xiamen
发货地
Fujian Xiamen

厦门市集美区后溪镇石星路451-1号101室
经营模式 生产型 服务型 其他
生产工艺
-

联系人信息

蓝先生 销售经理 18050101292 / liweiqi@hc-sin.com

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产品特点

1. Mechanical Properties: Fracture toughness is twice that of alumina (6.5-8.5 MPa·m½).
2. Thermal Properties: The coefficient of thermal expansion (3.0×10⁻⁶/°C) matches that of semiconductor chips.
3. Electrical Properties: Volume resistivity >10¹⁴ Ω·cm, dielectric breakdown strength >15 kV/mm.
4. Chemical Stability: Almost no reaction with molten metals and acid/alkaline solutions below 1200°C.

产品详情

Introduction to Silicon Nitride Ceramic Structural Components:

Silicon nitride ceramic (Si₃N₄) is an inorganic ceramic material that does not shrink during sintering and possesses the following characteristics:

1、High strength: Hot-pressed silicon nitride is one of the hardest materials in the world, with a bending strength of 780-980 MPa.

2、Low density: Lighter than metal materials, making it suitable for high-speed rotating components.

3、High temperature resistance: Maintains structural stability even at temperatures above 1000℃.

4、Structural characteristics: Composed of [SiN4] tetrahedra forming a three-dimensional network structure, with silicon atoms at the center and nitrogen atoms at the vertices.

Manufacturing Processes

1. Powder Metallurgy Method: Low cost, suitable for simple shapes, but results in uneven density.

2. Hot Press Sintering Method: High temperature and pressure (1700-1800℃), resulting in high density (flexural strength > 981 MPa).

3. Reaction Sintering Method: Silicon powder reacts with nitrogen gas, achieving near-theoretical density.

4. Injection Molding Method: Suitable for complex shapes, such as mobile phone back panels.

5. Isostatic Pressing: Uniform pressure, eliminating internal stress.

Common Market Products

1. Standard parts: Ceramic bearing balls, valve components, locating pins.

2. Customized parts: Irregularly shaped structural parts, precision equipment parts.

3. Electronic components: Ceramic substrates, insulating sleeves.

4. Industrial components: Extrusion rollers, liquid lifting tubes.

Application areas

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