Product published by Suzhou Jingpin Advanced Materials Co., Ltd.
倒装COB陶瓷基板
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Production Process
Raw Materials
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Powder Preparation
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Molding
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Sintering Process
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Processing Technology
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Product Description
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No. 558, Fenhu Science and Technology Park, Fenhu Avenue, Wujiang District, Suzhou City, Jiangsu Province, China
Contacts
Features
技术特点
1）金属线路可定制，最小线宽设计150μm，最小间隙设计100μm，满足倒装芯片应用要求；
2）金属线路印刷偏移量设计±50μm；
3）金属线路材质为银，线路方阻≤3mΩ/□；
4）阻焊采用油墨曝光工艺，图案解析度高；
5）产品符合欧盟ROHS环境要求，可以满足国内外市场需要
Product Details
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