Ceramic Grinding Media View on your phone

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Materials and content

Production Process

Raw Materials Oxide, Zirconium Dioxide (ZrO2), Yttrium Oxide(Y2O3), Cerium Oxide(CeO2)
Powder Preparation -
Molding -
Sintering Process -
Processing Technology -

Product Description

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Origin
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Port
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No.17, Malong Road, Huli District, Xiamen City, Fujian Province, China 361006
Business mode production trade
Production Process
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Product Details

Comparing to traditional grinding media, Ceramic Grinding Media have extremely excellent grinding performance. They have higher wear resistance, durability and lower wear loss. The superior properties greatly improve the grinding efficiency while increase the working life of the grinding media. The low wear loss guarantees the grinding materials against pollution.

Available ceramic materials for grinding media include:

Yttria Stabilized Zirconia (YSZ)
Ceria Stabilized Zirconia (CSZ)
Zirconia Silicate (ZS)

Available Sizes(mm):
Balls:  φ0.22-0.28, φ 0.2-0.4, φ 0.4-0.6, φ 0.6-0.8, φ 0.8-1.0, φ 1.0-1.2, φ 1.2-1.4……φ 3.0-3.2, φ 5, φ 6, φ 7, φ 8, φ 10, φ 15, φ 20
Cyclinder(only for YSZ): φ 3x3, φ 5x5, φ 7x7, φ 10x10, φ 12.7x12.7, φ 15x15…… 

Ceramic Grinding Media are mainly used for grinding and dispersion of structural ceramics, electronic ceramics, refractory materials, magnetic materials, metallurgy, medicine, food, cosmetic, coating, textile materials, ink, printing, dyeing, pigment etc.

Item       Unit             YSZ             CSZ              ZS
Color          -            White            Yellow            White
Composition          -       94.7% ZrO2
      5.2%  Y2O3
      78-80% ZrO2
     22-20%  CeO2
     60-65% ZrO2
        30%  SiO2
Bulk density      Kg/L       3.73(Φ2mm)        3.8(Φ5mm)     2.6-2.7(Φ2mm)
Specific density     g/cm3            ≥6.02           ≥6.2            4.0-4.1
Grain size       μm            ≤0.5             ≤0.5             ≤0.5
Moh's hardness        -            >9.0             >8.5             >8.5
Elastic modulus      Gpa            200             200             200
Fracture Toughness   MPam1/2              9               7               7
Thermal Conductivity     W/m.K              3               3               3
Thermal expansion
Coefficient(20-400 °C)
   10-6 / °C             9.6              9.6             9.6

贸易信息

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