产品特点
SMB (Sputtering Metal Bonding) Technology
• Sputtering bonding process uniquely applied to LX Semicon’s Ceramic Substrates differentiates from commercial brazing process.
• The process is developed to form a rigid and firm metal/ceramic reaction layer without brazing paste.
• Easily applied by combining various thickness of Cu plate asymmetrically
产品详情
提供AMB,陶瓷基板，如果您对我们的产品感兴趣，请联系我们。
