该产品由 MEMpro 发布
AMB,陶瓷基板
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材料及含量
氮化硅(Si₃N₄)
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氮化铝(AlN)
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联系人信息
产品特点
SMB (Sputtering Metal Bonding) Technology
• Sputtering bonding process uniquely applied to LX Semicon’s Ceramic Substrates differentiates from commercial brazing process.
• The process is developed to form a rigid and firm metal/ceramic reaction layer without brazing paste.
• Easily applied by combining various thickness of Cu plate asymmetrically
产品详情
贸易信息
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