Product published by MEMpro

AMB,陶瓷基板

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Materials and content

氮化硅(Si₃N₄) - 氮化铝(AlN) -

Markets

Electronic & Communication

Production Process

Raw Materials Silicon Nitride (Si3N4), Aluminum Nitride (AlN)

Powder Preparation -

Molding -

Sintering Process -

Processing Technology -

Product Description

Model
Brand: -

Origin: -
Port: -

MEMpro

首尔

Business mode trade service

Category Component / Part Supplier

Production Process

-

Contacts

- / kfkui***@naver.com

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Features

SMB (Sputtering Metal Bonding) Technology
• Sputtering bonding process uniquely applied to LX Semicon’s Ceramic Substrates differentiates from commercial brazing process.
• The process is developed to form a rigid and firm metal/ceramic reaction layer without brazing paste.
• Easily applied by combining various thickness of Cu plate asymmetrically