Product published by MEMpro
AMB,陶瓷基板
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Materials and content
氮化硅(Si₃N₄)
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氮化铝(AlN)
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Markets
Production Process
Raw Materials
Silicon Nitride (Si3N4), Aluminum Nitride (AlN)
Powder Preparation
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Molding
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Sintering Process
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Processing Technology
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Product Description
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- Brand
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- Origin
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Contacts
Features
SMB (Sputtering Metal Bonding) Technology
• Sputtering bonding process uniquely applied to LX Semicon’s Ceramic Substrates differentiates from commercial brazing process.
• The process is developed to form a rigid and firm metal/ceramic reaction layer without brazing paste.
• Easily applied by combining various thickness of Cu plate asymmetrically
Product Details
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