Product published by MEMpro
AMB,陶瓷基板
View on your phone Views: 0Category
Materials and content
氮化硅(Si₃N₄)
-
氮化铝(AlN)
-
Markets
Production Process
Raw Materials
-
Powder Preparation
-
Molding
-
Sintering Process
-
Processing Technology
-
Product Description
- Model
- Brand
- -
- Origin
- -
- Port
- -
Contacts
Features
SMB (Sputtering Metal Bonding) Technology
• Sputtering bonding process uniquely applied to LX Semicon’s Ceramic Substrates differentiates from commercial brazing process.
• The process is developed to form a rigid and firm metal/ceramic reaction layer without brazing paste.
• Easily applied by combining various thickness of Cu plate asymmetrically
Product Details
We offer AMB,陶瓷基板, if you are interested in it, please contact us.
