Aluminum Nitride ceramic

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Materials and content

Production Process

Raw Materials Aluminum Nitride (AlN)
Powder Preparation -
Molding -
Sintering Process -
Processing Technology -

Product Description

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No. 16-18, Zhoushan West Road, Anfeng Industrial Zone, Yubei, Yongjia County, Zhejiang Province
Business mode production trade
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Suppliers Contact details 135*****779 / cnzhengt***@163.com

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Product Details

I. Product Introduction


Aluminum nitride ceramic substrate:
It has excellent thermal conductivity, low dielectric constant and dielectric loss, and reliable insulation performance.
Excellent mechanical properties, non-toxic, high temperature resistance, chemical corrosion resistance;
Aluminum Nitride Substrate: It has excellent thermal, mechanical and electrical properties, high thermal conductivity, high strength and other excellent characteristics. With the rapid development of microelectronic devices, high thermal conductivity aluminum nitride substrates can be widely applied.
Aluminum nitride ceramic substrates, which have similar thermal expansion coefficient with silicon, have attracted much attention as new ceramic materials. Aluminum nitride ceramic substrate produced by our company is widely used in communication devices, high brightness LED, power electronic devices and other industries. It is an excellent electronic ceramic material.


2. Excellent performance
(1) The thermal conductivity is 5-10 times higher than that of alumina ceramics, which is equivalent to highly toxic beryllium oxide (BeO).
High thermal conductivity, which is 5 to 10 times of Al2O3
(2) The thermal expansion coefficient (4.3 *10-6/C) matches the semiconductor silicon material (3.5-4.0 *10-6/C).
Thermal expansion coefficient matches with hat of silicon
(3) Good mechanical properties, higher bending strength than BeO ceramics, close to alumina;
Good mechanical property, which is close to Al2O3 and better than BeO
(4) Excellent electrical performance, high insulation resistance and low dielectric loss;
Distinct electrical properties, with very high electrical resistivity and
Low dielectric loss
(5) Circuit materials have good compatibility and can be used for multi-layer wiring to achieve high density and miniaturization of packaging.
Compatible with circuit materials, multilayerwiring can be used to
Achieve high density and miniaturization of packaging
(6) Non-toxic, conducive to environmental protection.
Non-toxic, environment friendly


III. Application Areas


(1) Photoelectric Communication Devices
(2) LED industry
(3) Functional modules of automotive electronics
(4) High power supply module
(5) High Frequency Microwave Applied Devices
(6) Power and electronic components

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