Metallized AlN substrate
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Release date:
2020-12-03
RFQ ID:
CE-P2581-96
Category:
Components/Parts
Country/Region:
![India]()
India
India
Product Description
We are a contract manufacturing & service company in the electronic & photolithography field. We are looking for a company who can provide 100 units/months of Metallized AlN substrate for several years, specification
1. Metallized AlN Substrate (Ti-W + AU) or Standard | Square- 1\\\"x1\\\" | 100 Unit/Months
2. Thickness of AlN substrate : 0.625mm or 25 mil | Thermal conductivity of substrate >/= 170Watts/mK Metallization Scheme (Both Side)- Sputtering 1. Base Layer : Titanium-Tungsten (Ti-W) of 60nm thickness 2. Conductive Layer : Gold (AU ) 4.5-5um thickness
1. Metallized AlN Substrate (Ti-W + AU) or Standard | Square- 1\\\"x1\\\" | 100 Unit/Months
2. Thickness of AlN substrate : 0.625mm or 25 mil | Thermal conductivity of substrate >/= 170Watts/mK Metallization Scheme (Both Side)- Sputtering 1. Base Layer : Titanium-Tungsten (Ti-W) of 60nm thickness 2. Conductive Layer : Gold (AU ) 4.5-5um thickness
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