陶瓷基座(用于CMOS芯片真空封装,对真空度漏率和传输性能有要求)

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Release date: 2020-11-23
Product Description

Product Description

我们有陶瓷基座真空封装需求(封装CMOS芯片,要满足真空度和传输性能的一些要求),具体图纸还没确认输出,一些初步要求详见附件图片,评估下能否满足以下列的一些需求后再进一步沟通。

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