SiC陶瓷

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Release date: 2023-12-28
Product Description

Product Description

原始SiC纳米粉的平均粒径为40nm (β-SiC, 99.9%),SiC微米粉的平均粒径为100μm (α-SiC)。采用Al2O3(99.9%,30 nm)和Y2O3(99.99%,50 nm)作为烧结助剂。Al2O3与Y2O3的摩尔比为5:3,SiC纳米粉与烧结助剂的质量比为95:5,再加入微米粉为10 wt.%。将SiC纳米粉和烧结助剂的混合物与SiC微米粉用转速为180转/分的行星磨机研磨混合3小时,然后在100℃下干燥4小时、筛分,在真空压力为30 MPa下,在1500 - 1700◦C下进行SPS烧结,样品烧结5 min。 SPS升温速率在1000℃以下为100℃/min,在1000℃至最终烧结温度之间为80℃/min。烧结后,样品在炉内冷却至环境温度。

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