Silicon nitride grooveless ceramic frame
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材料及含量
产品特点
1、Bulk Density: 3.1-3.3 g/cm³.
2、Flexural Strength: 600-800 MPa (at room temperature).
3、Fracture Toughness: >6 MPa·m¹/².
4、Coefficient of Thermal Expansion: ~3.2×10⁻⁶/K (20-1000℃).
5、Thermal Conductivity: 20-25 W/m·K.
6、Vickers Hardness: 1500-1700 HV.
7、Maximum Operating Temperature: 1200℃ (in air), 1400℃ (in protective atmosphere).
产品详情
Introduction to Silicon Nitride Slotless Ceramic Frames:
Silicon nitride slotless ceramic frames are structural components made from high-performance silicon nitride (Si₃N₄) ceramic material. Silicon nitride ceramic is a high-performance ceramic material formed by the covalent bonding of nitrogen and silicon elements, possessing the following core characteristics:
1. High strength and high toughness: Bending strength can reach 600-800 MPa, and fracture toughness >6 MPa·m¹/², enabling it to withstand high loads and impact conditions.
2. Superior wear resistance: Vickers hardness is approximately 1500-1700 HV, second only to diamond and cubic boron nitride.
3. Excellent thermal stability: Operating temperature can reach above 1200℃, with a low coefficient of thermal expansion (~3.2×10⁻⁶/K).
4. Outstanding chemical inertness: Excellent corrosion resistance to most strong acids (except hydrofluoric acid), strong bases, and molten metals.
Production Process Characteristics
The production of silicon nitride slotless ceramic frames typically employs the following process route:
Raw material preparation: High-purity silicon nitride powder (purity >99.9%), with a particle size controlled to 0.1-1 μm.
1. Forming process:
Dry pressing: Suitable for simple-shaped parts, pressure 50-200 MPa.
Injection molding: Can produce complex shapes, requiring strict control of the debinding process.
Tape casting: Used for thin-sheet products, capable of producing substrates with a thickness of 10 μm.
2. Sintering process:
Reaction bonding sintering (RBSN): Performed at approximately 1400℃.
Gas pressure sintering (GPS): 1700℃, 30 MPa pressure, density >99%.
Precision machining: Requires grinding with diamond tools, achieving a machining accuracy of ±0.008 mm.
Application Fields
1. Mechanical Industry: High-precision bearing components, wear-resistant seals, mechanical structural support parts.
2. Electronics: Semiconductor equipment carriers, power module heat sinks, high-temperature insulation components.
3. Aerospace: High-temperature structural components, engine components, thermal protection systems.
4. Other Fields: Chemical corrosion-resistant components, nuclear industry applications, precision measuring instruments.
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