Suntech designs and manufactures various types of dispensing nozzles for the die bonding process.
Our dispensing nozzles can be made by SUS，tungsten and ceramics, and the dispensing nozzles have been widely used on ESEC (BESI), ASM or any other die bonding machine.
ID can be 20μm:
- Body is made by SUS, and tip is made by Ceramics.
- The inner features inside the ceramics is designed to optimize the fluid flow and ease tip cleaning.
- The high hardness (up to 2000HV) makes the tip not prone to wear.