Sinoceram Technology (zhengzhou) Co., Ltd.

Uniform Social Credit Code (USCC):9141018558855090X7 Zhengzhou, Henan, China http://www.sinoceram.com/
CERAMIC SUBSTRATES USED IN DIRECT BONDING COPPER
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CERAMIC SUBSTRATES USED IN DIRECT BONDING COPPER

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Products Introduction:96% Al2O3  ceramic substrates,lasered substrates and stamped substrates.
Applications of Material :
    The company produces high performance Al2O3 ceramic substrates with international advanced technologies. Our products have been widely used in the fields of telecommunication, automotive engineering, direct bonding copper (DBC), printer, LED lights etc, and heat diffusing boards of electronic components. We can produce various products with different sizes and shapes according to customer requirements.


Characteristics of 96% Al2O3  ceramic substrates:
High thermal conductivity
Good thermal shock resistance
Good surface quality, flat surface
High dielectric strength , low dielectric constant and dielectric loss
Good mechanical hardness
Steady physical and chemical property, anti-erosion

Good stability,good wresting properties, excellent precision in size

 

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